UNI-Mx – Testing and Packaging

Flexible, customised – economic through proven standards

Electronic components can be tested and packaged with the fully automatic machine in a reliable and speedy manner. The high-speed mode even produces a throughput of up to 4 components/sec.

Each machine is composed from standard modules enhanced specifically for the customer. This makes each testing and packaging system a customised special machine without the expense of an elaborate new design. The modular design makes this testing and packaging machine flexible even in the long term. Requirements are modified in the future? No problem thanks to the adaptation, exchange or addition of individual modules.

The range of the fully automatic modules comprises:

  • Input module – to receive the electronic components
  • Feeder module for In-Carrier®
  • Image processing module – for component position scanning
  • Measuring modules
    • electrical testing of the components
    • optical testing of coplanarity, pitch, lead length, etc.
    • sound measurement for microphone testing
  • Interim storage – for the interim storage of components in the system
  • Output modules
    • Tape module – for the packaging of components in a blister tape
    • Multi-channel metal rails – discharge of components in multi-channel metal rails
    • Jedec-Trays – output of components in Jedec Trays
    • Plastic sticks – output of components in plastic sticks
    • Bulk material – output of components as bulk material in collection containers

The development of new functions is based on proven know-how. Each development expands the broad scope of the modules of the UNI-Mx.

100 % inspection for 100 % reliability

Extremely reliable optical and electrical measurements make the UNI-Mx a 100% inspection unit. A code is applied to the individual parts, carrier parts or in the work documents allowing the allocation of components to your batches. For example, if safety functions are affected recall actions can be initiated in a targeted manner.

Output

Tape and Reel: Following the reliable inspection the tested components are packaged in blister tapes of different widths.

Additional output options: Jedec Trays, multi-channel metal rails, plastic sticks or bulk in collection containe

Speed

The modules can be exchanged within 5 minutes. Exchange modules save time with retooling and simplify maintenance.

The high-speed mode permits a testing and packaging throughput of up to 4 components/sec. With some modules up to 5 types of components can be tested simultaneously.

Process integration

The testing and packaging machine is fully integrated in the production process. Input modules are developed specifically for the respective workpiece carrier systems of the customers. If requested, product data management with label printer and customer databases, e.g. can be linked to the UNI-Mx.

Reference

Robert Bosch GmbH, S&P Dienstleistungen in der Mikroelektronik GmbH

Your contact to BOS:
Berlin Oberspree
Sondermaschinenbau
GmbH & Co. KG

Ostendstraße 1 - 14
12459 Berlin, Germany

(+49) 30 53 88 09-0
bos(at)bos-berlin.de